Efi consumer grade so kosi ahunmu grade so no, nsonsonoe bɛn na ɛwɔ chips ntam?

Grade Division of Chips no yɛ nokwarem no, chip application environment no mu mpaapaemu no mu kyekyɛ. Yɛn common chips no taa kyekyɛ mu anan, civilian grade (consumer grade), industrial grade, automotive grade ne military grade (aerospace grade). Mprempren, specification chip a ɛkorɔn sen biara a yebetumi anya ne kar specification chip no. Sɛ wode toto consumer-grade chips ho a, automotive-grade chips betumi agyina ɔhyew a ano yɛ den ne dwumadie tebea ano.

Esiane sɛ asraafo-grade ne kar-grade chips no wɔ tumi kɛse nti, so ɛrenyɛ nea ɛdɔɔso sɛ wɔbɛma chips nyinaa adu gyinapɛn ahorow a ɛwɔ soro-grade chips no so sɛnea ɛbɛyɛ yiye?

Chip grading nyɛ mmerɛw saa. Ɛfa ɔkwan a wɔfa so yɛ ɔmansin no ho nhyehyɛe, nea wɔyɛ, ne nea etwa to a wɔde kyekyere nneɛma ne nea wɔde sɔ hwɛ no nyinaa ho ankasa. High-Standard chips no betumi ayɛ nea ɛfata mma nneɛma afoforo a atwa yɛn ho ahyia. Nea edi kan koraa no, chips a ɛwɔ specifications a ɛkorɔn no taa kyerɛ bo a ɛkɔ soro, na sɛ wotua application scenarios a ɛrentumi nyɛ yiye ho ka a, ɛbɛtew ɛka a wɔbɔ-mfinimfini no so. Bio nso, ɛnyɛ sɛ dodow a chip no dodow kɔ soro no, dodow no ara na ahoɔhare a wɔde yɛ nneɛma no yɛ ntɛmntɛm. Ɛtɔ da bi a, chip no de adwumayɛ no fã bi bɛbɔ afɔre sɛnea ɛbɛyɛ a ɛrenhwe ase wɔ application tebea titiriw bi anim.

Sɛ yɛbɛka no tiawa a, redundancy design ne sɛ ɛbɛma ahotoso a ɛwɔ chip no mu no akɔ soro de agye sika a wɔde bɛto mu no akɔ soro.

Circuits a ɛho nhia a ɛwɔ chip no mu no nyɛ ade a wɔsɛe no, efisɛ ɛsɛ sɛ wosiesie chip no koraa bere a wohyia nnwuma a wonnim na ama wɔatew bere a wɔde bɛyɛ adwuma wɔ tebea soronko mu no so. Chip design abenfoɔ kyerɛkyerɛ redundant circuitry no mu: "Yɛbɛtumi asiesie system no ama yɛanya buffering a ɛdɔɔso wɔ processor ne memory no ntam sɛdeɛ ɛbɛyɛ a sɛ memory no yɛ load to maximum na ɛwɔ maximum transaction flow wɔ processor ne memory latency ntam a, ɛnde processor no bɛtumi akata transactional nsɛm pii so". Caches bi a ɛho nhia betumi asiw krak ano bere a memory no boro so bere a ɛreyɛ adwuma akɛse-scale parallel tasks no. Nea ɛka ho no, wobetumi anya nkɛntɛnso koro no ara nso ama memory redundancy nhyehyɛe.

Nokwarem no, redundant circuits a wɔbɛyɛ no nyɛ copy ne paste a ɛyɛ mmerɛw. Sɛ nhwɛso no, chip factory no betumi ama processing capacity margin no akɔ soro wɔ processing processes bi mu, te sɛ redundant memory ne cache a yɛaka ho asɛm wɔ atifi hɔ no, a ebetumi ama chip no adi buffer timing ho nsɛm ne nsakrae a ebetumi aba wɔ bere a ɛsɛ mu no ho dwuma; Redundancy nso betumi ayɛ IP core a ɛho akokwaw a wobetumi apaw, ɛwom sɛ ɛnyɛ nea ɛyɛ kɔmputa ahoɔhare a ɛyɛ ntɛm sen biara de, nanso ebetumi ama ahotoso kɛse; Redundancy nso betumi ama processor no afa ɔkwan a ɛyɛ den so sen sɛ ɛbɛyɛ ɔkwan a etu mpɔn bere a worebɔ algorithm ahorow bi ho akontaa no, sɛnea ɛbɛyɛ yiye biara kwati ɔhaw a akontaabu mu mfomso de ba no.

Mpɛn pii no, redundancy nyɛ nea ɛho nhia. Engineers in the field of autonomous driving in the industry have doxed out astifin astiduas of the design the design are rules of thumb. Wobetumi abisa sɛ wɔmma wɔn 30% margin na ama wɔanya bere ho nhyehyɛe. Eyi betumi adi tebea horow a ɛnteɛ a wohyia wɔ honam fam nhyehyɛe no mu no ho dwuma. Saa margin yi nyɛ nwura, te sɛ insurance ma honam fam nhyehyɛe anaa nhyehyɛe ho nsɛm a ɛho hia a ɛho hia."

Ansa na awiei koraa no monocrystalline silicon bɛyɛ chip ma yɛn sɛ yɛde bedi dwuma no, ɛsɛ sɛ ɛfa design, manufacturing, packaging, testing ne links afoforo mu. Atirimpɔw titiriw biako a ɛwɔ nneɛma a wɔde kyekyere nneɛma ho ne sɛ wɔbɛbɔ die a ɛyɛ mmerɛw no ho ban afi nneɛma a atwa yɛn ho ahyia no ho.

Fa Aerospace-grade chips sɛ nhwɛso. Consumer-Grade chips betumi anya ahobammɔ a ɛdɔɔso denam plastic a wɔde di dwuma so, bere a aerospace-grade chips taa yɛ ceramics anaa dade, na wɔde kɔbere a wɔde ahyɛ mu ma ayi cosmic rays ne high-temperature environments nso atoto ho. Sɛnea ɛbɛyɛ a ɛbɛtew nneɛma a ɛto so abien a mframa bɔne de ba no so no, wɔhyɛ mframa soronko bi nso ma bere a wɔde nneɛma gu mu no.

Mprempren, kar no ho nkyerɛkyerɛmu dodow ne nkyerɛkyerɛmu a ɛkorɔn sen biara a adetɔfo betumi ahu. Sɛ yɛhwɛ kar ho mmara a wɔhwehwɛ no a, ɛho hia sɛ ɛyɛ hyew wɔ ne dwumadi mu na ama -40℃adu 125℃, na ɛho hia nso sɛ ɛyɛ anyinam-adanse, nsu-adanse, ne ahodwiriw{7}}adanse. Enti, mpɛn pii no, ɛsɛ sɛ car-grade chips susuw ɔhyew a wɔsɛe no ne nsɛm a wɔde hyɛ mu ho bere a wɔde nneɛma gu mu no. Mprempren, wɔde kar mu ntini dodow no ara ahyɛ SIP mu. Module dodow no ara a ɛhwehwɛ sɛ kɔmputa no gyina pintinn no ka bom ma nneɛma a wɔde kyekyere nneɛma ho banbɔ. Bere koro no ara mu no, nkitahodi kwan a ɛda module ahorow ntam no so tew, na hokwan a ɛwɔ hɔ sɛ ɛbɛka bere a wɔde data mena no so tew.

Nokwarem no, sɛ́ ɛyɛ mfiridwuma-grade, automotive-grade anaa asraafo ahunmu-grade chip, wɔ ahosiesie a wɔayɛ no mpɛn pii wɔ mfiase no akyi no, ɛsɛ sɛ wɔyɛ paw ne sɔhwɛ a emu yɛ den wɔ awiei. Chips a ɛwɔ grade biara mu no, chip manufacturers na ɛyɛ na ɛyɛ self-sealed, na ɛsɛ sɛ wɔkyerɛ grades no wɔ pene a ɔman no mu dwumadibea ahorow a ɛfa ho no pene so akyi.

Mprempren, wɔkyekyɛ chips mu bɛyɛ sɛ nea ɛwɔ mu no mu anan, nea wɔde di dwuma, mfiridwuma mu abasobɔde, kar mu abasobɔde ne asraafo (aerospace). Chips a ɛsono ne su ne nea ɛkyerɛ no wɔ ahwehwɛde ahorow fi nhyehyɛe so kosi nneɛma a wɔde kyekyere ne sɔhwɛ fã ahorow so, na sɛnea wɔde di dwuma no nso yɛ soronko koraa. Mpɛn pii no, dodow a chip no ho nsɛm kɔ soro no, dodow no ara na chip redundancy nhyehyɛe no yɛ den, dodow no ara na nneɛma a wɔde ahyɛ mu no mu yɛ den, na ɛyɛ den na ɛyɛ katee wɔ sɔhwɛ no ho.